ISIE2021- Kyoto (The 30th International Symposium on Industrial Electronics)

Dates
20th (Sun) -23rd (Wed) June, 2021
Venue
Miyako Messe, Kyoto, Japan

Program

Plenary Speakers

Date: June 21 (Mon), 20:30-21:30 (JST)

Architectures, Topologies and Components for High-Frequency, High-Density Power Conversion
Prof. David Perreault
Massachusetts Institute of Technology, United States of America

Abstract & Bio

Date: June 22 (Tue), 17:20-18:20 (JST)

Toward the sustainable and inclusive society, how should companies innovate their businesses?
Dr. Yukiko Araki
Senior Representative of Government & External Relations for Europe,
Hitachi Europe GmbH Belgium Branch Representative, Japan

Abstract & Bio

Date: June 23 (Wed), 19:10-20:10 (JST)

Wearable Devices, Embedded Systems, and Artificial Intelligence for Aging Patient Empowerment
Prof. Juan J. Rodriguez-Andina
University of Vigo, Spain

Abstract & Bio

INTEROP Plugfest Program

Program (PDF)

Important Dates

Special Session Proposal
December 1, 2020
January 6, 2021
Tutorial Proposal
December 1, 2020
January 6, 2021
Full Paper Submission
January 15, 2021
February 15, 2021
March 5, 2021
March 15, 2021
Notification of Acceptance
March 15, 2021
March 31, 2021
April 5, 2021
April 15, 2021
April 17, 2021
Submission of Final Manuscripts
April 20, 2021
April 30, 2021
May 7, 2021
May 15, 2021
Deadline for Early Registration
20 May, 2021

IEEE Open Journal of the Industrial Electronics Society

Contact

ISIE 2021 Secretariat
c/o JTB Communication Design, Inc.
3-23-1 Shiba, Minato-ku,
Tokyo 105-8335, Japan
isie2021@jtbcom.co.jp
  • IEEE
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